ADATA™ Technology, a leading manufacturer of high-performance DRAM modules and NAND Flash storage application products, today announced an expansion to its XPG™ Gaming Series DDR3 lineup with a 2600G 16GB dual channel kit. ADATA will be giving the new DDR3 modules their first appearance in live demonstrations held throughout the 2013 Consumer Electronics Show (CES), running this year from January 8 - 11.
ADATA’s XPG Gaming V2.0 modules all feature 2oz copper, 8 layer PCB (Printed Circuit Board) aluminum heat spreaders employing Thermal Conductive Technology (TCT). Through this specialized design, each memory chip is in direct contact with the heat spreaders for better overall heat dissipation. The new XPG 2600G memory runs at timings of CL 11-13-13-35 at 1.65 volts, with 2600 MHz speed coinciding with transfer bandwidth as high as 20,800 megabytes per second.
According to Ted Tsai, Senior Product Manager at ADATA: “We pride ourselves in meeting the challenges set forth by the world’s most serious gaming enthusiasts, as well as the overclocking community.” He added further: “This XPG 2600G 16GB dual channel kit meets the most rigorous demands for memory density and speed. Furthermore, our specialized heat sink ensures outstanding stability even when systems are pushed to the limit, speed-wise”.
ADATA will be hosting a hospitality suite at this year’s CES, and the XPG Gaming V2.0 Series DDR3 2600G modules will be on display along with the company’s other latest innovations.