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The last vector of mobility is form factor. With improved heat exchanger technology, Intel is
able to cool the Pentium-M processor using coolers with smaller form factors. This has enabled
various manufacturers to release Centrino notebooks in very sleek form factors. At IDF, Intel
showcased Centrino notebooks from vendors such as IBM, Samsung, Toshiba, Motion Computing,
FIC, Gateway and ASUS. So far, Samsung had one of the best designs around, with a two spindle
design that’s just about an inch thick.
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