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Lapping" is the art of sanding the surface area of the base of a heatsink flat (and then secondarily, smooth). This increases heatsink (HS) surface area contact with the CPU die, which means more effective heat absorption, and thus better CPU cooling. Now, overclockers and tweakers have known about lapping for quite some time now - and many have devised their own 'special' methods towards creating an extremely flat surface area on their respective HSF's.
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