 |
Fujitsu plans 300-mm fab
|
|---|
| Fri, March 19 2004 | 7:36PM | PermaLink |
Feedback?
|
|
Meanwhile, Fujitsu has enlisted more than ten partners called "leading edge technology" partners. They have evaluated Fujitsu's 90-nm process technology and agreed to work on design and production. Fujitsu will open its libraries and basic IP to those partners. Some will also contribute financing for construction of the 300-mm fab, mostly by paying in advance for their orders. The payments could total ¥30 billion (about $280 million), which will form a part of the total ¥160 billion investment.
Closer collaboration between design and production is required as process technology scales down. Collaboration is easier for IDMs than for most foundries. By working together from upstream designs, Fujitsu's said its IDM strategy will resolve the problem.
Transmeta Corp. is among the partners, and Ono said their collaboration proves the worth of the new-IDM strategy. Matthew R. Perry, Transmeta's president and CEO, said Fujitsu's support enabled Transmeta to achieve major production milestones for its 90-nm Efficeon processor.
For the coming fiscal year beginning in April, Fujitsu said it expects to produce less than 2,500 8-inch wafers per month at its Akiruno line used for 90-nm device production. About half the production there is for partners. The Akiruno line is a 200-mm wafer line used for pilot and early stage volume production.
In 2005, when the new 300 mm fab begins operation, Fujitsu expects production for its partners will increase ten fold. In 2006, production for partners will more than double from 2005, while production of Fujitsu's device is expected to grow modestly, doubling fiscal 2004 production.
|
|
FULL STORY @
EETIMES
(http://www.eetimes.com/semi/news/showArticle.jhtml?articleID=18400955)
|
 |
|
|
|
|
RSS Newsletter
