Is the aim had of to cool 2 effectively new Xeon 2.6 (SL6EQ) and their 512 KB of mask, the whole assembled on a ASUS PCDL to obviously be able to have the maximum of computing power. In other words, a large refrigerating power estimated at approximately 250 W with full load to keep at the lowest possible temperature! One thus will develop a system with phase shift in "direct one die" which does not exist on the current market, to cool 2 processors at the same time using a single compressor. The whole will be carried out with a possible material more limited.