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Digitimes reports; "While the semiconductor industry has yet to migrate to 45nm production, major players, such as Intel and Taiwan Semiconductor Manufacturing Company (TSMC), are already gearing up the development of the 32nm node. Industry sources pointed out that TSMC is also seeing breakthroughs in its development at the 32nm node. The world's number-one pure play foundry has already conducted a few tests on 32nm wafer prototypes, the sources said. TSMC CEO Rick Tsai recently revealed that the company has an ad hoc team devoted to the development of 32nm technology. According to ITRS's estimation, products at the 22nm node may not be available on the market until 2015 at the earliest. As for 32nm processes, the industry is still probing the pros and cons of adopting extreme ultraviolet (EUV) or double-exposure 193i immersion lithography, according to ITRS. While it may still take a while for 32nm or 22nm processes to mature, products at the 45nm node will soon be available. Gargini said Intel's 45nm technology is mature, and volume production will start in the second half of 2007."
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