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Coolermaster NanoFusion Thermal Compound - Coolermaster NanoFusion Thermal Compound
Tue, December 27 2005 | 5:28PM | PermaLink Feedback?

Being a true innovator in providing PC thermal solution, Cooler Master considers every aspect of cooling, including providing the best solution for a small air gap. NanoFusion - the revolutionary thermal compound newly released by Cooler Master - surpasses every overclocker's expectation in terms of its Bond Line Thickness (BLT), Thermal Conductivity, Thermal Resistance and Specific Gravity. With the accomplished 0.019mm BLT, NanoFusion has successfully minimized thermal resistance to 0.065 ¢J -cm 2/w @ 40psi, which has been proven to be unmatched by any other thermal grease in the market.

The full press release is posted here.
Original URL, circa 2005:

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