Being a true innovator in providing PC thermal solution, Cooler Master
considers every aspect of cooling, including providing the best solution for a
small air gap. NanoFusion - the revolutionary thermal compound newly released by
Cooler Master - surpasses every overclocker's expectation in terms of its Bond
Line Thickness (BLT), Thermal Conductivity, Thermal Resistance and Specific
Gravity. With the accomplished 0.019mm BLT, NanoFusion has successfully
minimized thermal resistance to 0.065 ¢J -cm 2/w @ 40psi, which has been proven
to be unmatched by any other thermal grease in the market.The full press release is posted here.