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Akita Elpida - World's Thinnest 1.4 mm MCP With 20 Dies - PCstats.com Akita Elpida - World's Thinnest 1.4 mm MCP With 20 Dies
Mon, April 23 2007 | 4:10PM | PermaLink Feedback?

PCSTATS.comAkita Elpida Memory, Inc. announced the successful development of a 1.4 mm thick Multi Chip Package (MCP) with 20 stacked dies, making it the world's thinnest. Nowadays, as portable devices such as mobile phones and digital still cameras become even thinner and more compact as well as more highly functional, demands are being made for greater sophistication of semiconductor products such as flash memories, DRAMs, and logic which bring these features into reality. Furthermore, demand continues to rise for 5- and 7-die stacking as well as for achieving compact, thin packages.

Responding to such market needs, the development group of Akita Elpida took up the challenge to develop multi-chip stacked thin packages, thereby achieving their current success. Development of the world's thinnest package are introduced in the following process sequence:

1. Grinding technology to achieve 30 micrometer thick chips
2. Handling technology for 30 micrometer thick wafers
3. Technology for picking up and die-attaching 30 micrometer thick chips
4. 40 micrometer low loop wire bonding technology
5. Overhang wire bonding technology
6. Technology for injecting resin into narrow gap

Akita Elpida plans from now on to put this package technology to work to establish high-yield and low-cost manufacturing technology for multi-chip stacked packages such as existing 5- and 7-die multi-chip stacked packages, thereby doing their utmost to expand their business.  For more information about Elpida, please visit http://www.elpida.com.

FULL STORY @ Archived from ELPIDA
http://www.elpida.com
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