Vonage is in big
trouble, its CEO quits and spending will be trimmed. EMI
and The Beatles have settled a royalty dispute. IBM shows off some new
technology that sounds very spiffy.
The technology, called through-silicon vias, or TSV, involves connecting
different components--processors and memory, for example--or different cores
inside of two respective chips through thousands of tiny wires that will carry
data back and forth. Now, chips mostly transfer data over channels called buses,
which can get overwhelmed, embodied in wires. With TSV, far more data can be
transferred per second in a less energy-intensive manner.