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IBM and its new goodies - IBM and its new goodies
Thu, April 12 2007 | 4:13PM | PermaLink Feedback?

Vonage is in big trouble, its CEO quits and spending will be trimmed. EMI and The Beatles have settled a royalty dispute. IBM shows off some new technology that sounds very spiffy.

The technology, called through-silicon vias, or TSV, involves connecting different components--processors and memory, for example--or different cores inside of two respective chips through thousands of tiny wires that will carry data back and forth. Now, chips mostly transfer data over channels called buses, which can get overwhelmed, embodied in wires. With TSV, far more data can be transferred per second in a less energy-intensive manner.

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