SiS was determined to diversify its product portfolio since last year when it decided to get involved in DRAM Module business. In order to provide a complete and bundle solution for its customers, SiS has been focusing on developing the advanced DDR and DDR2 specifications. So far, DRAM Module business accounts for 20~30% of company’s total revenue.
The major reason why SiS can have such a great success is because of the accumulated developing experiences in innovating PC-related chipsets. Moreover, the strong R&D team and the quick responses to the market trend have contributed to the success. SiS DRAM modules have been well-accepted by global customers with the higher compatibility, more reliability, and better quality. SiS is the worldwide first to simultaneously adopt TSOP, BGA, and CDFN packaging in manufacturing DRAM modules.
At CeBIT 2007 Hannover, SiS presented its DRAM module lineup which includes DDR2-800, DDR2-667, DDR2-533, DDR-400, and DDR333 for both desktop PCs and notebook PCs. The exhibition of DRAM modules section is not only physical products but also the accomplishment and capability of SiS’ developing DRAM module business. For the future, SiS will continue to develop more advanced DRAM module which features less power-consumption, more cost-effective, larger storage capacity and faster transfer speeds to satisfy even more customers’ requirements.