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TSMC reach agreement for 450mm wafer manufacturing transition - TSMC reach agreement for 450mm wafer manufacturing transition
Tue, May 06 2008 | 3:35PM | PermaLink Feedback?
Intel, Samsung Electronics and Taiwan Semiconductor Manufacturing Company (TSMC) announced they have reached agreement on the need for industry-wide collaboration to target a transition to larger, 450mm-sized wafers starting in 2012. The transition to larger wafers will enable continued growth of the semiconductor industry and help maintain a reasonable cost structure for future integrated circuit manufacturing and applications.
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