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Mushkin Announces Triple-Channel Memory Kits for the Intel Core i7 Platform - Mushkin Announces Triple-Channel Memory Kits for the Intel Core i7 Platform
Tue, November 18 2008 | 5:13PM | PermaLink Feedback?
Mushkin, Inc. (, a global leader in high-performance memory products, today announced the release of its triple-channel memory kits designed specifically for the new Intel® Core i7TM platform. The flagship offering of the new memory kits is the XP3-12800 7-8-7, allowing end users to extract higher performance at 1600MT/s than competitors’ products while staying within safe operating voltages. Additionally, early adopters of the new platform will find Mushkin’s triple-channel products stable and reliable, ensuring a trouble-free migration. “We’ve worked diligently to create parts for the Core i7 platform that push specifications to unprecedented levels while maintaining the high quality and reliability standards of our existing products,” said Brian Flood, director of product development for Mushkin. “Our triple-pack customers will be rewarded with the utmost reliability from our standard rated products, and greatly increased performance from our high performance line.” The new triple packs are immediately available at in 3GB (3x1GB) and 6GB (3x2GB) kits. Every module is hand-tested beyond its rated specification and features Mushkin’s FrostByte heatspreader which keeps the modules within safe operating temperatures. Like all Mushkin products, these modules are backed by a lifetime warranty and an industry-leading technical support staff.
FULL STORY @ Archived from MUSHKIN

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