AMD Athlon™ II X2 Processor Specifications:
Model Number & Core Frequency: X2 250 = 3.0GHz
L1 Cache
Sizes:
64K of L1 instruction and 64K of L1 data cache per core (256KB total L1 per
processor)
L2 Cache
Sizes:
1MB of L2 data cache per core (2MB total L2 per processor)
Memory Controller
Type: Integrated 128-bit wide memory
controller *
Memory Controller Speed:
2.0GHz with Dual Dynamic Power Management
Types of Memory
Supported: Support for unregistered DIMMs up to PC2-6400
(DDR2-800MHz) -AND- PC3-8500 (DDR3-1066MHz)
HyperTransport 3.0
Specification: One 16-bit/16-bit link @ up to 4.0GHz full duplex (2.0GHz
x2)
Total Processor-to-System Bandwidth: Up to 33.1GB/s bandwidth [Up
to 17.1 GB/s total bandwidth (DDR3-1066) + 16.0GB/s
(HT3)]
Up to 28.8GB/s bandwidth [Up to 12.8 GB/s total bandwidth (DDR2-800) + 16.0GB/s
(HT3)]
Packaging:
Socket AM3 938-pin organic micro pin grid array (micro-PGA)
Fab
location:
GLOBALFOUNDRIES Fab 1 Module 1
Process
Technology:
45-nanometer DSL SOI (silicon-on-insulator) technology
Approximate Die
Size: 117.5 mm2
Approximate Transistor count: ~ 234 million
Max
Temp:
74o Celsius
Core
Voltage:
0.85-1.425V
Max
TDP:
65 Watts
AMD Phenom™ II X2 550 Black Edition Processor
Specifications:
Model Number & Core Frequency: X2 550 Black Edition = 3.1GHz
L1
Cache
Sizes:
64K of L1 instruction and 64K of L1 data cache per core (256KB total L1 per
processor)
L2 Cache
Sizes:
512KB of L2 data cache per core (1MB total L2 per processor)
L3 Cache
Size:
6MB (shared)
Memory Controller
Type: Integrated 128-bit wide memory
controller
Memory Controller Speed:
2.0GHz with Dual Dynamic Power Management
Types of Memory
Supported: Support for unregistered DIMMs up to PC2-8500
(DDR2-1066MHz) -AND- PC3-10600 (DDR3-1333MHz)
HyperTransport 3.0
Specification: One 16-bit/16-bit link @ up to 4.0GHz full duplex
(2.0GHz x2)
Total Processor-to-System Bandwidth: Up to 37.3GB/s
bandwidth [Up to 21.3 GB/s total bandwidth (DDR3-1333) + 16.0GB/s
(HT3)]
Up to 33.1GB/s bandwidth [Up to 17.1 GB/s total bandwidth (DDR2-1066) + 16.0GB/s
(HT3)]
Packaging:
Socket AM3 938-pin organic micro pin grid array (micro-PGA)
Fab
location:
GLOBALFOUNDRIES Fab 1 Module 1
Process
Technology:
45-nanometer DSL SOI (silicon-on-insulator) technology
Approximate Die
Size: 258 mm2
Approximate Transistor count: ~ 758 million
Max
Temp:
70o Celsius
Core
Voltage:
0.850-1.425V
Max
TDP:
80 Watts
AMD Phenom™ II X4 905e Processor Specifications:
Model Number & Core Frequency: X4 905e = 2.5GHz
L1 Cache
Sizes:
64K of L1 instruction and 64K of L1 data cache per core (512KB total L1 per
processor)
L2 Cache
Sizes:
512KB of L2 data cache per core (2MB total L2 per processor)
L3 Cache
Size:
6MB (shared)
Memory Controller
Type: Integrated 128-bit wide memory
controller *
Memory Controller Speed:
2.0GHz with Dual Dynamic Power Management
Types of Memory
Supported: Support for unregistered DIMMs up to PC2-8500
(DDR2-1066MHz) -AND- PC3-10600 (DDR3-1333MHz)
HyperTransport 3.0
Specification: One 16-bit/16-bit link @ up to 4.0GHz full duplex (2.0GHz
x2)
Total Processor-to-System Bandwidth: Up to 37.3GB/s bandwidth [Up
to 21.3 GB/s total bandwidth (DDR3-1333) + 16.0GB/s
(HT3)]
Up to 33.1GB/s bandwidth [Up to 17.1 GB/s total bandwidth (DDR2-1066) + 16.0GB/s
(HT3)]
Packaging:
Socket AM3 938-pin organic micro pin grid array (micro-PGA)
Fab
location:
GLOBALFOUNDRIES Fab 1 Module 1
Process
Technology:
45-nanometer DSL SOI (silicon-on-insulator) technology
Approximate Die
Size: 258 mm2
Approximate Transistor count: ~ 758 million
Max
Temp:
70o Celsius
Core
Voltage:
0.825-1.25V
Max
TDP:
65 Watts
AMD Phenom™ II X3 703e Processor Specifications:
Model Number & Core Frequency: X3 705e = 2.5GHz
L1 Cache
Sizes:
64K of L1 instruction and 64K of L1 data cache per core (384KB total L1 per
processor)
L2 Cache
Sizes:
512KB of L2 data cache per core (1.5MB total L2 per processor)
L3 Cache
Size:
6MB (shared)
Memory Controller
Type: Integrated 128-bit wide memory
controller *
Memory Controller Speed:
2.0GHz with Dual Dynamic Power Management
Types of Memory
Supported: Support for unregistered DIMMs up to PC2-8500
(DDR2-1066MHz) -AND- PC3-10600 (DDR3-1333MHz)
HyperTransport 3.0
Specification: One 16-bit/16-bit link @ up to 4.0GHz full duplex (2.0GHz
x2)
Total Processor-to-System Bandwidth: Up to 37.3GB/s bandwidth [Up
to 21.3 GB/s total bandwidth (DDR3-1333) + 16.0GB/s
(HT3)]
Up to 33.1GB/s bandwidth [Up to 17.1 GB/s total bandwidth (DDR2-1066) + 16.0GB/s
(HT3)]
Packaging:
Socket AM3 938-pin organic micro pin grid array (micro-PGA)
Fab
location:
GLOBALFOUNDRIES Fab 1 Module 1
Process
Technology:
45-nanometer DSL SOI (silicon-on-insulator) technology
Approximate Die
Size: 258 mm2
Approximate Transistor count: ~ 758 million
Max
Temp:
72o Celsius
Core
Voltage:
0.825-1.25V
Max
TDP:
65 Watts