GIGABYTE TECHNOLOGY Co., Ltd, a leading manufacturer of motherboards, graphics cards and other computing hardware solutions is pleased to announce their latest generation H55/H57 series motherboards, based on the Intel® H55 and Intel® H57 chipset and leveraging the success of the GIGABYTE Ultra Durable™ 3 design featuring 2x copper PCB and delivering a host of cutting-edge features including innovative Smart6™ PC management tools, Dynamic Energy Saver™ 2 power saving utilities, DualBIOS™ and support for Energy Using Products Directive (EuP), for a powerful, yet power efficient multimedia platform.
“GIGABYTE once again leads the motherboard industry and sets the standard for delivering high speed data transfer and richer video playback capabilities for HD multimedia home entertainment devices,” commented Tim Handley, Deputy Director of Motherboard Marketing at GIGABYTE Technology Co. Ltd. “Featuring next generation storage capabilities including USB 3.0* and high performance digital DisplayPort* connectivity, as well as GIGABYTE’s own unique 3x USB Power Boost, the GIGABYTE GA-H57M-USB3 and GA-H55M-USB3 provide a compelling solution for users wanting the ultimate multimedia system.”
Supporting the latest Intel® Core™ i3 and Core™i5 LGA 1156 socket processors featuring the first on-die integrated graphics and DDR3 memory controller (codename Clarkdale), the GIGABYTE H55/H57 series motherboards provide exceptional high definition content playback unmatched by previous integrated graphic solutions. Making sure users have the very latest connectivity options, the GIGABYTE H55/H57 series support a wide range of display interfaces including VGA, DVI, HDMI and DisplayPort. For those wanting to push their graphics performance to even higher levels, the GIGABYTE H55/H57 series support overclocking of the GPU core frequency for a performance gain of up to 13%.
The GIGABYTE GA-H55M-USB3 and GA-H57M-USB3 motherboards support the latest generation SuperSpeed USB 3.0 technology made possible through an onboard NEC uPD720200 host controller. With superfast transfer rates of up to 5 Gbps, users are able to experience an almost 10x improvement over USB 2.0. Additionally, backwards compatibility with USB 2.0 assures users of long term use of their legacy USB 2.0 devices. The onboard NEC SuperSpeed USB 3.0 technology also provides new power management features that include increased maximum bus power and device current draw to better accommodate power-hungry devices.
The GIGABYTE GA-H55M-USB3 and GA-H57M-USB3 motherboards feature a 3x USB power boost, delivering greater compatibility and extra power for USB devices. GIGABYTE’s unique USB power design is also able to efficiently regulate output over the full voltage range, which greatly enhances USB device compatibility. In addition, dedicated lower resistance fuses ensure lower voltage drops, and provide more stable and plentiful power delivery.
The GIGABYTE GA-H57M-USB3, GA-H55M-USB3 and GA-H55M-UD2H motherboards feature the next generation graphics display interface DisplayPort that delivers up to 10.8 Gbps of bandwidth over standard cables, providing billions of colors, enabling the fastest refresh rates and the greatest color depths.
DualBIOS™ is a GIGABYTE patented technology that automatically recovers BIOS data when main BIOS has crashed or failed. Featuring 2 physical BIOS ROMs integrated onboard, GIGABYTE DualBIOS™ allows quick and seamless recovery from BIOS damage or failure due to viruses or improper BIOS updating.
GIGABYTE Smart 6™ is designed with user-friendliness in mind, offering a combination of 6 innovative software utilities that provides an easier and smarter way for managing your system. Smart 6™ allows you to speed up your system performance, boot-up time, managing a secured platform or recovers your system easily with a click of mouse button.