VIA Eden Platform Powers New HP Thin Clients
Proven ultra-low power VIA Eden(TM) processor selected by HP for new range of
space-saving thin clients
Taipei, Taiwan, 7 June 2005 - VIA Technologies, Inc, a leading innovator and
developer of silicon chip technologies and PC platform solutions, today
announced that the high-performance, energy-efficient VIA Eden(TM) Platform will
be integrated into the new HP Compaq t5125, t5520 and t5525 thin clients.
Bringing enhanced levels of performance, reliability and functionality to the
corporate environment, this design win further strengthens VIA's leadership in
this fast-emerging market segment.
Providing businesses with greater manageability, scalability, security and
flexibility, thin clients offer a holistic cost-effective approach to corporate
productivity with a network-based computing model. The new HP Compaq t5125,
t5520 and t5525 fine-tune the concept with a range of smart, small footprint
designs, capable of meeting the demands of the corporate environment with the
high-performance, ultra-low power of VIA Eden processors.
"We are delighted that HP has adopted the VIA Eden Platform for their new
range of thin client products, strengthening our presence in this rapidly
growing market," commented Richard Brown, Vice President of Marketing, VIA
Technologies, Inc. "These new thin clients leverage our unique combination of
power efficiency, performance and security."
The new range of HP Compaq thin clients feature the highly energy-efficient
VIA Eden ESP processor with ultra-low thermal profile, enabling higher
performance in a small form factor and fanless design, and feature 128MB RAM and
up to 256MB Compact Flash that offers enough storage memory for most current
firmware and future updates and upgrades.
"By using the VIA Eden Platform, our thin clients are using lower power for
key components which will provide our customers with the lifecycles and return
on investment they expect from HP," said Greg Schmidt, Product Marketing
Manager, Thin Client Marketing, Imaging and Personal Systems Group, HP.
"Additionally, VIA's high-performance, low-power design allows for a smaller
footprint. This is a big bonus to a traditional desktop customer wishing to
capitalize on the security and manageability of thin client computing in a
small, reliable, and cost efficient client."
The new thin clients are expected to be available mid-June 2005.
About the VIA Eden Platform
The VIA Eden Platform is based on the ultra-low power native x86 VIA Eden ESP
processor and a choice of highly integrated and power efficient VIA chipsets and
companion chips. Available at speeds ranging from 300MHz to 1GHz and featuring
the lead-free EBGA package that helps reduce thermal density, VIA Eden ESP
processors measure a mere 35mm x 35mm x 1.5mm, making them suitable for consumer
electronics, industrial and commercial devices that require compatibility with
PC hardware and software. With Thermal Design Power (TDP) values ranging from
2.5W to a maximum of 7W when running at 1GHz, the VIA Eden ESP processor boasts
industry-leading low power consumption from a fanless native x86 processor.
For more information on the VIA Eden ESP processor, please visit the VIA Eden
ESP processor website at: