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Driving the Emergence of Mobility 2.0 at VIA Technology Forum 2007
Date: Monday June 04, 2007
Category: Notebooks
Manufacturer Link: VIA
Mobility 2.0 is defined as going beyond today's limited mobile Internet to a full-featured Web 2.0 browsing and computing experience at the fingertips through the next generation of UMDs

 Driving the Emergence of Mobility 2.0 at VIA Technology Forum 2007

VIA and Microsoft head up the VTF2007 keynote session highlighting the hardware and software innovations enabling the Mobility 2.0 lifestyle

Taipei, Taiwan, 30 May 2007 - VIA Technologies, Inc., a leading innovator and developer of silicon chip technologies and PC platform solutions, today disclosed more details about the "Ultra Mobility" central theme of VTF2007 being held on 6th June, with its focus on the hardware, software, design and services trends of ultra mobility, and the strategies that these industries should take to expedite the transition to Mobility 2.0.

VIA President and CEO, Wenchi Chen will open the morning keynote session, laying out VIA's vision for the ultra mobile lifestyle, and will be followed by Otto Berkes, chief architect of Microsoft's ultra mobile PC campaign, who makes a welcome return to VTF addressing the issues of software and design innovation in this space. Other keynote speakers including Packard Bell will expand on this theme further, covering different aspects of ultra mobility and giving examples of key upcoming designs and technologies.

One of the two specialist technology tracks in the afternoon, "Enabling Ultra Mobility", will look in greater detail at the technologies and infrastructure required to fuel innovation in this market, with speakers from a range of organizations including the Taiwan Government's Department of Information Management, international telco GTNT, and mobile security specialists Stonewall Networks.

"As the demand to stay connected, entertained and organized everywhere grows, it is clear that our leadership in shrinking the form factor through intelligent, power efficient design is enabling ever more innovative ultra mobile devices, but hardware building blocks are only part of the equation," said Wenchi Chen, President and CEO, VIA Technologies, Inc. "That's why we are delighted to be again joined by Microsoft and key industry partners at VTF this year, as we work together to provide all the necessary tools to make Mobility 2.0 a reality."

Mobility 2.0 is defined as going beyond today's limited mobile Internet to a full-featured Web 2.0 browsing and computing experience at the fingertips through the next generation of Ultra Mobile Devices (UMDs). Weighing under a kilogram, UMDs are based on the x86 architecture, and bridge the gap between the notebook and the mobile phone, bringing the benefits of a PC with all the applications, information and entertainment users require to an ultra portable handheld form factor.

About the VIA Technology Forum 2007

VTF2007, the eighth annual VIA Technology Forum, will be held at the Grand Hyatt Taipei Hotel on Wednesday 6 June 2007, alongside the Computex trade show. The VIA Technology Forum has firmly established itself as one of the most prominent technology events on the industry's global calendar, highlighting the principal strategies of VIA and partners and defining key industry trends. This year's theme is "Ultra Mobility", a principal element of VIA's "Small is Beautiful" philosophy, and represents VIA's strategy to drive the x86 platform into ever smaller and more portable form factors. For more information on the VIA Technology Forum, please visit our VTF2007 website at:

About the VIA C7-M Ultra Mobile Platform

The VIA C7-M Ultra Mobile Platform is based on the low power drawing VIA C7-M ULV ultra mobile processor, which has been specifically designed for small form-factor, x86 ultra mobile devices (UMDs). The VIA C7-M ultra mobile processor is based on the VIA CoolStream architecture and is manufactured using IBM's 90nm SOI process, and has a low profile nanoBGA2 package measuring just 21mm x 21mm. VIA C7-M ULV processors are available at speeds of 1.0-1.5GHz with a maximum thermal design power (TDP) as low as 3.5 watts and idle power as little as 0.1 watt, ensuring unparalleled battery life. This is complemented by a highly integrated and power efficient unified chipset, enabling designs with drastically reduced weight, size and thickness. More information on the VIA C7-M Ultra Mobile Platform and UMD partner products may be found on the VIA website at:

To learn more about the Ultra Mobile Lifestyle, please join our vibrant community of mobility enthusiasts at

About VIA Technologies, Inc.

VIA Technologies, Inc. (TSE 2388) is the foremost fabless supplier of market-leading core logic chipsets, low power x86 processors, advanced connectivity, multimedia and networking silicon, and complete platform solutions that are driving system innovation in the PC and embedded markets. Headquartered in Taipei, Taiwan, VIA's global network links the high tech centers of the US, Europe and Asia, and its customer base includes the world's top OEMs, motherboard vendors and system integrators.

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