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GIGABYTE at CeBIT 2009 Hall 21
Date: Sunday March 01, 2009
Category: Motherboards
Manufacturer Link: gigabyte
GIGABYTE is again excited to participate in CeBIT 2009, highlighting their latest Ultra Durable 3™ technology on their latest lineup of motherboards. GIGABYTE once again leads the motherboard industry for the highest quality, most innovative motherboard design with their latest Ultra Durable 3™ technology featuring double the amount of copper for the Power and Ground layers of the PCB.
 

GIGABYTE Technology Co., LTD, a leading manufacturer of motherboards and graphics cards is proud to showcase latest range of high performance, low working temperature motherboards featuring GIGABYTE's proprietary Ultra Durable™ 3 Technologies, including a sneak peek of the first AMD platform DDR3 solution, the GA-MA790FXT-UD5P with support for the new AM3 processors, as well as demonstrations of the latest Intel® Core™ i7 platform motherboards based on Intel's X58 chipset.

GIGABYTE is again excited to participate in CeBIT 2009, highlighting their latest Ultra Durable 3™ technology on their latest lineup of motherboards. GIGABYTE once again leads the motherboard industry for the highest quality, most innovative motherboard design with their latest Ultra Durable 3™ technology featuring double the amount of copper for the Power and Ground layers of the PCB. Most traditional motherboard designs utilize a single ounce of copper for each layer, whereas GIGABYTE’s ultra Durable 3 motherboards feature 2 ounces per layer.

Intel Platform

To start things off, on display will be live demos of GIGABYTE's flagship X58 motherboard, the GA-EX58-EXTREME as well as the GA-EX58-UD4P, both designed from the ground up to unleash the awesome power of Intel’s new Core™ i7 processors and equipped with a host of new features including the new QPI interface, 3 channel DDR3 support, 3 Way SLI™ and CrossFireX™ support, Ultra Durable 3 technology and the industry’s most extensive range of overclocking features. The GIGABYTE GA-EX58-EXTREME motherboard features the revolutionary new GIGABYTE Hybrid Silent-Pipe 2, a fusion thermal solution that combines GIGABYTE’s proprietary screen cooling technology, external heat sink and liquid cooling with chipset water block to deliver maximum thermal performance.

Also on showcase will be the GIGABYTE GA-EP45-UD3P, delivering native support for DDR2 memory up to 1366+MHz. The GIGABYTE GA-EP45-UD3P features the latest Ultra Durable 3™ technology and GIGABYTE Dynamic Energy Saver Advanced technology, providing optimized power savings, ultra cooling performance and extended system durability.

AMD Platform

On the AMD side, GIGABYTE presents the GA-MA790FXT-UD5P, their first AMD "Dragon Platform" qualified motherboard with next generation AMD AM3 Phenom™ II processors support, enabling the very latest in definitive high performance platforms for work, home and play. Supporting the new AMD AM3 socket, the GIGABYTE GA-MA790FXT-UD5P allows users to elevate their rig beyond the standard limits with support for support the highest performing ever 45nm AMD Phenom™ II processors featuring HyperTransport 3.0 technology. With an integrated DDR3 memory controller in the CPU, the GIGABYTE GA-MA790FXT-UD5P is able to reach memory speeds up to 1666+MHz (OC) for blazing fast memory access for today’s latest applications and games with greater energy efficiency.

Advanced connectivity options are key to any high end system, and the GIGABYTE GA-MA790FXT-UD5P delivers with a combined total of up to 10 SATA 2.0 device support, enabling GIGABYTE's Smart Backup technology which allows users to connect up to 4 SATA 2.0 devices for effortless hardware-based RAID data protection on-the-fly. The GIGABYTE GA-MA790FXT-UD5P also features Dual Gigabit LAN connections with Teaming, which allows 2 single connections to act as 1 single connection for twice the bandwidth to improve overall throughput.

Be sure to visit GIGABYTE at CeBIT 2009, Hall 21 (Booth number: D56)

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   10 / 25 / 2014 | 8:46AM
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