Intel To Showcase 0.13 Micron-Based Mobile Processor At TechX NY Trade Show
SANTA CLARA, Calif., June 22, 2001 - Intel Corporation today announced plans to show its next-generation mobile processor based on 0.13 micron process technology at the TechX NY trade show June 26-28. The new mobile Pentium® III processor-M will deliver speeds in excess of 1 GHz and includes new features such as 0.13 micron process technology, enhanced performance, and new power management technologies enabling thinner, lighter notebooks.
The mobile processor, shipping in volume to customers worldwide, will officially launch in the third quarter. Leading PC makers are now preparing new systems based on this processor.
"As the worldwide mobile PC processor and technology leader, Intel is committed to designing cutting-edge products that deliver the best mobile computing experience for every size notebook," said Frank Spindler, vice president and general manager of Intel's Mobile Platforms Group. "With the combination of performance, enhanced power management technologies and a scaleable new chipset architecture, the new mobile Pentium III processor-M will power a wave of exciting, new systems featuring great performance, long battery life, small size and wireless communications."
Intel's 0.13 micron process technology features the world's fastest transistors, the smallest transistor gate, the thinnest gate oxide and the smallest SRAM cell in volume production today. These features combined deliver the highest performance and lowest power consumption across all mobile PC segments.
The Intel booth at the TechX NY trade show is number 3436.