Dual Layer Memory Cooling
Each of Corsair DOMINATOR
Twin3X2048-1800C7D memory modules is cooled by four individual aluminum heat
spreaders that act as one. The system
is called the Dual-Path Heat Xchange (DHX) system, and it's basically two large black heatsinks on the
DDR3 BGA memory modules, and two smaller silver-cooured aluminum heat spreaders which conduct
heat from the PCB itself. The heatspreaders are attached with a
strong thermal adhesive, so there is no way to remove any of the heatsinks on this memory
Dominator Fan frame cools up to four memory modules below with a steady
stream of quiet airflow.
With the way BGA chips are designed, most of the heat
generated in the DRAM actually travels through the solder balls at the bottom
and into the PCB.
With that in mind, Corsair redesigned the DOMINATOR PCB for board level thermal
management and implemented thermal vias - areas where the copper trace lines serve to conduct
heat from below the DRAM to the top of the module.
A large gold section along the top of the memory circuit board comes in contact with two
the small aluminum heatsinks (one on either side). These heatsinks draw the excess
heat away from the PCB itself, for more efficient cooling of the memory modules,
and circuit board.
The Corsair Dominator Fan frame cools up the four separate heatspreader
components on each memory module.
Corsair's approach does a
much better job at keeping DDR3 memory cool than conventional heatspreaders do. To further improve the cooling ability of its memory, Corsair
bundles (or sells separately) the DOMINATOR Airflow fan bracket. Equipped
with three 40mm fans, this little aluminum device clips onto four memory
DIMM slots and blows air directly down onto the DOMINATOR memory heatsinks.
During testing the Airflow fan bracket generated little to no noise.