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Shuttle XPC SD11G5 Small Formfactor PC Review
Shuttle XPC SD11G5 Small Formfactor PC Review - PCSTATS
To reach a happy silent equilibrium, the Shuttle XPC SD11G5 is powered by a mobile Intel Pentium M processor.
 91% Rating:   
Filed under: Computer / SFF PCs Published:  Author: 
External Mfg. Website: Shuttle Dec 30 2005   C. Sun  
Home > Reviews > Computer / SFF PCs > Shuttle XPC SD11G5

Rear I/O Connections and Heatsink System

The rear of the case is certainly quite interesting. Starting from the middle left users will find the onboard audio connectors for the 7.1-channel speaker configuration, the line-in port and optical SP/DIF in/out jacks. On the bottom left is the motherboard clear CMOS button, a very nice feature for those who like to push the limits!

There is also a standard IEEE 1394 jack, the PS/2 connectors, TV output (S-video), LAN and two USB slots, a VGA and DVI monitor connector (a block of jumpers on the inside selects between the PCI-E x16 slot and the onboard DVI jack) and the six-pin 12V DC power connector.

To the right of that are the two expansion slot openings for the PCI Express devices. There are also a couple knock-outs at the top of the aluminum chassis for an optional wireless LAN antenna and parallel port.

Filling up most of the space on the rear of the Shuttle XPC SD11G5 is a large honeycomb exhaust vent for the 'Integrated Cooling Engine' (ICE) heatsink. The honeycomb pattern has been shown to allow air to pass through it with the least amount of turbulence. It's important that users leave enough space behind the computer so that airflow from this vent is not restricted.

Shuttle 'Integrated Cooling Engine'

The ICE heatsink works in conjunction with a speed controlled 92mm fan, that according to the manufacturers acoustic test report, produces about 24.5 dBA with 'smart fan' settings enabled.

At full speed, noise levels from the fan may reach upwards of 43.8 dBA.

The ICE thermal solution mounts onto the processor with a custom-spaced set of screw-points, and transfers the heat about 8 inches to the back of the SFF PC where the fan is located.

What makes the ICE heatsink tick are a set of nickel plated copper heatpipes that bridge the distance between the processor and the stacked aluminum fin heat exchanger. The heatpipes are soldered to a copper baseplate that makes direct contact with the silicon core of the Intel Pentium M processor (thermal compound is included). There is a foam ring on the base of the heatsink to help prevent the core from being chipped.

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Contents of Article: Shuttle XPC SD11G5
 Pg 1.  Shuttle XPC SD11G5 Small Formfactor PC Review
 Pg 2.  Overview of Features and Accessibility
 Pg 3.  External features of the SFF case
 Pg 4.  — Rear I/O Connections and Heatsink System
 Pg 5.  Internal Components and Installation
 Pg 6.  Memory and Expansion Cards
 Pg 7.  PCI Express x16 Videocard Installation
 Pg 8.  XPC SD11G5 BIOS Options
 Pg 9.  Benchmarks: SYSMark 2004
 Pg 10.  Benchmarks: Winstone 2004, Winbench 99
 Pg 11.  Benchmarks: SiSoft Sandra, Super Pi
 Pg 12.  Benchmarks: PCMark04, PCMark05
 Pg 13.  Benchmarks: 3DMark2001, 3DMark05
 Pg 14.  Comanche 4, X2: The Threat
 Pg 15.  Benchmarks: UT2003, UT2004
 Pg 16.  Benchmarks: Doom 3, Conclusion

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